§ The E1M™ platform · v1.0
Open edge AI, vendor-neutral.
Pin-compatible modules across Alif, Renesas, DeepX. One SDK. Hardware engineers and AI builders shouldn't have to choose.
# Same file. Any module.
schema_version: 2
som:
sku: E1M-AEN701
hw_rev: r1
carrier:
name: E1M-EVK
cores:
m55_app:
os: zephyr
app: ./fw
peripherals: [gpio, i2c, pdm, eth]
libraries: [tensorflow-lite-micro]
6
E1M modules · one SDK
132×
AI compute range
2
Pin-compatible form factors
3
Silicon vendors · 1 API
§ Edge AI development · AI modules for robotics
Powering the future of robotics and smart manufacturing.
Smart machines need smart brains. Alp Lab delivers that intelligence through advanced Edge AI hardware — modules that help machines think, work, and react more efficiently in real-world conditions.
Open Standard
Hardware-agnostic, pin-to-pin compatible modules that work with any silicon vendor. Build once, deploy everywhere.
Unified SDK
One SDK across all modules. Streamline development with consistent APIs and tools.
Industrial Reliability
Built for harsh environments. Extended temperature ranges, vibration resistance, and long-term availability.
Edge AI Performance
Optimized for AI workloads at the edge. Run complex models locally with minimal latency.
§ Portfolio compatibility
Replace what you need. Keep what you trust.
Our E1M portfolio offers full footprint compatibility — seamless upgrades or downgrades without redesigning the base hardware. A vendor-agnostic approach that gives you flexibility and freedom of choice.
Flexible Edge AI system-on-module architecture: high-performance compute in a compact design. Small, powerful modules that handle heavy workloads while keeping response times low — ideal for industrial automation and busy factory floors.
Same footprint, every chip
E1M · E1M-X
35×35 mm / 45×65 mm
§ The Alp SDK stack
Write once, run on any E1M module.
Alp SDK is the unification software layer for ALP Lab edge AI modules. A single C/C++ API works across every E1M SoM — present and future — wrapping each vendor's SDK on top of the chosen OS (Zephyr / Yocto / bare-metal). Single-OS or heterogeneous, the application surface stays identical.
AI Framework
On-device inference
On-device runtimes
Model families
Offline training only
Dev Tooling
Build, orchestrate, flash
v0.6Alp SDK
One unified <alp/*.h> API
Peripherals
Audio
Camera
Inference
IoT / BLE
Security
Display / GUI
HW Info
DSP / Power
Heterogeneous IPC (v0.6 NEW)
80 Tier-1 chip drivers + Tier-2 community
User libraries (board.yaml libraries:)
Operating System
Per-core slice (cores: in board.yaml) · heterogeneous = peers on same SoM
Zephyr · M-class cores
Yocto · A-class cores
Bare-metal · no-RTOS
Vendor SDK
We wrap each one
Hardware + HAL
E1M open-standard form factor
Standalone firmware against <alp/...>
headers, or alp-studio codegen — same API surface either way.
§ E1M™ product line
AI performance that scales with your needs.
From 0.25–0.5 TOPS always-on sensing to 33 TOPS heterogeneous compute — same unified Alp SDK, same C/C++ API, same toolchain. Lower expenses with custom-built SoM options; shape your module to include only the functions that matter.
- MCU+MPU
- 2×M55 + opt. A32
- NPU
- 2× Ethos-U55
- Form
- 35×35 · 312p
- Power
- <1 mW always-on
Coming soon
- CPU
- 2×A55 @ 1.7 GHz
- NPU
- Ethos-U65 (500 GOPS)
- Form
- 35×35 · 312p
- TSN
- 2× 1 GbE TSN
- CPU
- 4×A55 @ 1.8GHz
- NPU
- 4 TOPS
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3
Coming soon
- CPU
- 4×A55 + 2×R8
- NPU
- 80 TOPS (sparse)
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3·2×ETH
- CPU
- 4×A55 @ 1.8GHz
- NPU
- 29 TOPS
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3·2×ETH
Coming soon
- CPU
- 4×A55 + 2×R8
- NPU
- 33 TOPS dense
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3·2×ETH
§ Solutions by industry
Purpose-built edge AI for every vertical.
The best edge AI for robotics, manufacturing, and beyond — enabling machines to see, learn, and move. Built on a proven SoM platform that turns bold ideas into real, working edge AI products.
Drones & UAVs
Autonomous flight, on-device
Real-time AI processing for autonomous flight, object detection, and mission planning — no cloud round-trip.
Read the vertical brief →
Robotics
See, learn, move
AI-powered automation, collaborative robots, and smart robotic systems for modern industry.
Read the vertical brief →
Industrial automation
Inspect, predict, optimize
Visual inspection, predictive maintenance, and process optimization at the edge.
Read the vertical brief →
Agriculture
Precision farming, autonomous
AI-powered crop monitoring and autonomous farm equipment running independently in the field.
Read the vertical brief →
Energy
Real-time grid + solar
Smart grid monitoring, solar tracking, and equipment diagnostics measured at the asset.
Read the vertical brief →
Smart infrastructure
City sensing, privacy-first
People counting, traffic flow, energy monitoring — AI at the sensor, never streams raw video.
Read the vertical brief →
§ E1M™ SoM hardware + Alp SDK™
Industrial Camera — Smart Eye.
The Alp Lab Smart Camera is a lightweight, all-in-one industrial AI camera with customization options — designed for manufacturing, robotics, warehouse automation, and workplace safety.
- · Renesas V2N AI processor with longevity support
- · DeepX M1 AI accelerator, high performance, low power
- · Lightweight IP67 housing for harsh-environment mobility
§ E1M™ open standard · v1.0
An open standard, not a walled garden.
The E1M specification fixes the carrier-board pinout, mechanical envelope, and electrical interface of two form factors — 35 × 35 mm (312 pads) and 45 × 65 mm (496 pads). A single carrier board hosts any silicon that conforms.
Published under CC BY-SA 4.0. Machine-readable pinouts. Third parties welcome.
E1M · "Normal"
35 × 35 mm
312 pads · LGA
- Ethernet
- 2
- USB 3.x
- 1
- MIPI CSI
- 2
- PCIe 4-lane
- 1
Hosts: AEN · N93
E1M-X · "Extended"
45 × 65 mm
496 pads · LGA · + parallel LCD
- Ethernet
- 2
- USB 3.x
- 2
- MIPI CSI
- 4
- PCIe 4-lane
- 2
Hosts: V2N · V2H · +M1 variants
§ Silicon partners
Built on industry-leading silicon.
We wrap every vendor's SDK under one C/C++ API on top of Arm CMSIS, so you ship the same firmware regardless of which silicon ends up under the module.
Preferred Partner
RZ/V2N · V2H · DRP-AI3 on E1M-X
MCU + edge-NPU partner
Ensemble E3–E8 on E1M-AEN
AI accelerator partner
DX-M1 on V2N+M1 and V2H+M1
Long-term silicon commitments. Industrial-grade longevity. Shared roadmaps.
§ Authorised distributors
Sourcing E1M, worldwide.
Order modules, dev kits, and production quantities through our channel network — local stock, local logistics, local support.
§ Trusted by innovators
What teams are building on E1M.
" By integrating Alp Lab's E1M Alif Module, we enabled real-time predictive maintenance at the edge, quickly detecting rail faults. This improved reliability and cut both maintenance costs and data transmission. "
Ali Acur
CTO · Delphisonic ↗
" Thanks to Alp Lab's E1M module, we added AI vision to our drone in weeks. We doubled our camera inputs while halving power consumption compared to our previous platform. "
M. Salih Cetin
CEO · Mavinci Dynamics ↗
" Integrating Alp Lab's E1M Alif Module streamlined our hydronic device development. The platform enabled rapid addition of advanced features with reliable performance and low power use. "
Sezer Sener
CTO · Rhodark ↗
§ Developer resources
Everything you need to build edge AI applications.
Ready to build the future?
NXP i.MX 93