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What's new at Alp Lab.

Product launches, SDK releases, customer wins, partner deals. Subscribe to the newsletter to get it in your inbox.

Recent news

  1. Alp SDK tooling — the alp CLI and VS Code extension
    Release

    Alp SDK v0.9.0 — the alp CLI front door + portable-API conformance

    One alp command drives build, run, flash, emit, doctor, and monitor across every E1M module. A 13-class × 8-case conformance suite becomes the gate for new SoM ports, portable SE-backed identity/power/peer-boot surfaces land, and I²C/SPI target mode goes real — alongside pre-1.0 breaking renames.

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  2. E1M-AEN module — Alif Ensemble E8 System-on-Module
    Release

    Alp SDK v0.8 — E1M-AEN801 silicon bring-up on Alif Ensemble E8

    A second SoM family now carries silicon evidence: 15 of 17 peripheral apps PASS on real E8 hardware, with real NPU inference from MRAM on Ethos-U85, dual-core HE↔HP RPC, SE-CryptoCell compute, and the CC3501E Wi-Fi/BLE bridge. v0.8.1 follows with a repo-wide silicon-accuracy doc sweep.

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  3. § Spec
    Spec

    E1M Standard 1.2 published

    Dedicated debug-console UART (DBG_TX/DBG_RX) added on E1M at AD3/AE3, mirroring E1M-X; E1M reserved-pad count drops 36 → 34. E1M-X Ethernet MDI pair order reversed. Loom form-factor stays 1.0 — a doc-level revision.

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  4. Alp SDK VS Code extension — IDE Hub dashboard
    Release

    Alp SDK VS Code extension launched

    First-class E1M development inside VS Code — board-aware editing, build wrappers, and project tooling without leaving your editor.

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  5. § Release
    Release

    Alp SDK v0.7.0 — production Yocto image + OS-topology contract

    A hardened alp-image-prod production image boots the V2N bench from eMMC, with reproducible firmware banners and a CA55 1.8 GHz opt-in. Per-core OS is now class-derived, and system-manifest v1 is pinned as the IDE/tool contract.

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  6. § Release
    Release

    Alp SDK v0.6.0 released — first silicon-verified stack

    The E1M-X V2N bench verified the GD32 supervisor bridge end-to-end: functional suite 26/26, 20-row HIL soak 253/253, A/B OTA, and wire protocol v0.7 with the stale-reply kill. AEN and i.MX 93 remain pre-HiL.

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  7. § Release
    Release

    Alp SDK v0.6 ships with heterogeneous OS orchestration

    New <alp/rpc.h> framed RPMsg over OpenAMP, system-wide IPC manifest, and per-core OS slicing — Zephyr, Yocto, and bare-metal running side by side on a single SoM.

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  8. § Spec
    Spec

    E1M Standard 1.1 published

    On-module connectivity SHALL clause clarified for compliant module vendors. GD32G553 routing detail added to the reference SoM appendix.

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  9. Mavinci logo
    Customer

    Mavinci flies first batch of autonomous drones on E1M-X V2N+M1

    29 TOPS on-board perception in flight, with roughly half the power draw of their previous platform. Production deployment across a fleet of survey drones.

    Read more →

  10. DEEPX logo
    Partnership

    DEEPX DX-M1 accelerator joins the silicon partner roster

    Up to 33 TOPS dense via the E1M-X +M1 variant. Quantization and INT8 calibration available as a paid service through Alp Lab.

    Read more →

  11. DelphiSonic logo
    Customer

    DelphiSonic ships predictive-maintenance sensor for trains on E1M-AEN

    Always-on vibration anomaly detection at sub-1 mW. Deployed on rolling stock to catch rail and bearing faults before they become safety incidents.

    Read more →

  12. Alp Lab E1M-AEN always-on edge AI module
    Product

    E1M-AEN reaches First Customer Shipment

    Six SKUs (E1M-AEN701 / 501 / 301 / 801 / 601 / 401) on the Alif Ensemble E3-E8 family are now generally available. Starting from $29.

    Read more →

Press kit & media

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Brand assets, product photography, executive bios, and approved boilerplate. Email press@alplab.ai with your outlet and deadline and we'll send a tailored kit.

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Boilerplate

Alp Lab builds the E1M open standard and shipping module families (E1M-AEN, E1M-X) for edge AI — from sub-1 mW always-on perception to 33 TOPS heterogeneous compute. Headquartered in Västerås, Sweden, with customers across robotics, smart manufacturing, mobility, and industrial IoT.

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